International Cooperation
The Lunghwa Semiconductor Manufacturing Center (LSMC) at Lunghwa University of Science and Technology is a specialized facility established to meet the strong talent and technology demands of Taiwan's semiconductor industry.
The center's core spirit is "Technology Drives the Future, Small Steps Create a Big Future," and its development policy is based on professionalism, innovation, precision, and excellence. The following is a brief introduction to LSMC's core strengths and development priorities:
Four Core Development Axes:
Precision: Focusing on midstream and back-end semiconductor processes and technologies, implementing practical operations in line with industry standards.
Innovation: Investing in the research and development of innovative technologies in semiconductor materials, components, and specialty chemicals, and fostering industry-academia collaboration.
Talent Development: Cultivating readily employable midstream and downstream semiconductor process engineers, as well as packaging and testing professionals.
Collaboration: Partnering with leading semiconductor companies and corporations to create an industry-like environment that combines theory and practice.
Center Resources and Featured Facilities
LSMC integrates key resources from the university's College of Engineering and Department of Semiconductor Engineering, primarily encompassing the following core technologies and facilities:
Semiconductor Component Manufacturing Center: Possesses a complete photolithography process environment (including wafer cleaning, coating, developing, exposure, and wet etching), thin-film diffusion furnaces, plasma-assisted atomic layer deposition (ALD), and other core mid-process equipment.
Semiconductor Packaging and Testing Center: Establishes an industry-standard "power semiconductor module packaging and testing industrial environment factory," equipped with wafer dicing machines, fully automated die bonders, laser external inspection and packaging machines, and component measurement platforms, allowing students to conduct full-line practical internships on campus.
Services and Collaborative Projects
LSMC is committed to building an open and diverse collaborative platform, providing the following services:
Technical Services and Analytical Measurement: Utilizes precision instruments to provide semiconductor material analysis, specialty chemical testing, and component measurement.
International Collaboration: Attracts internationally renowned universities to learn and exchange ideas, and cultivates internationally competitive semiconductor talent. Senior-Year Internships: Customized courses tailored to industry needs allow students to intern at top companies (such as ASE Technology Holding Co., Ltd. and iST Technology Co., Ltd.) during their senior year, achieving a seamless transition to employment upon graduation.
The center's core spirit is "Technology Drives the Future, Small Steps Create a Big Future," and its development policy is based on professionalism, innovation, precision, and excellence. The following is a brief introduction to LSMC's core strengths and development priorities:
Four Core Development Axes:
Precision: Focusing on midstream and back-end semiconductor processes and technologies, implementing practical operations in line with industry standards.
Innovation: Investing in the research and development of innovative technologies in semiconductor materials, components, and specialty chemicals, and fostering industry-academia collaboration.
Talent Development: Cultivating readily employable midstream and downstream semiconductor process engineers, as well as packaging and testing professionals.
Collaboration: Partnering with leading semiconductor companies and corporations to create an industry-like environment that combines theory and practice.
Center Resources and Featured Facilities
LSMC integrates key resources from the university's College of Engineering and Department of Semiconductor Engineering, primarily encompassing the following core technologies and facilities:
Semiconductor Component Manufacturing Center: Possesses a complete photolithography process environment (including wafer cleaning, coating, developing, exposure, and wet etching), thin-film diffusion furnaces, plasma-assisted atomic layer deposition (ALD), and other core mid-process equipment.
Semiconductor Packaging and Testing Center: Establishes an industry-standard "power semiconductor module packaging and testing industrial environment factory," equipped with wafer dicing machines, fully automated die bonders, laser external inspection and packaging machines, and component measurement platforms, allowing students to conduct full-line practical internships on campus.
Services and Collaborative Projects
LSMC is committed to building an open and diverse collaborative platform, providing the following services:
Technical Services and Analytical Measurement: Utilizes precision instruments to provide semiconductor material analysis, specialty chemical testing, and component measurement.
International Collaboration: Attracts internationally renowned universities to learn and exchange ideas, and cultivates internationally competitive semiconductor talent. Senior-Year Internships: Customized courses tailored to industry needs allow students to intern at top companies (such as ASE Technology Holding Co., Ltd. and iST Technology Co., Ltd.) during their senior year, achieving a seamless transition to employment upon graduation.